Manufacturing advanced chips requires innovative thinking that pushes the boundaries of elastomer sealing performance. By operating at the forefront of elastomer technology, we are helping you to solve your sealing challenges, which enables your customers to build smaller, faster, more powerful, and more power-efficient electronic devices.
As a trusted, collaborative partner, we work closely with LAM engineers to design elastomer components, utilizing our optimized material compounds, that are proven to provide maximum tool efficiency. Our innovative elastomer materials have led the field since the first high purity translucent Perlast® perfluoroelastomer was launched in 1999, and we continue to be a fundamental enabler of the silicon roadmap.
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Discover how our NEW perlast Helios material combines high purity, excellent plasma resistance and high temperature capability up to 300C with no compromise.Watch Video
Semicon Material Brands
Elastomer material brands typically used in semiconductor applications
The ultimate perfluoroelastomers for sealing applications where chemical resistance and high temperature performance are critical.
A unique range of fully organic elastomers ideally suited to thermal, dynamic and specific plasma processes
Nanofluor elastomers are hybrid materials, bridging the gap between low cost fluoroelastomer (FKM) and high cost perfluoroelastomer (FFKM) in plasma ash or resist strip, chlorine and CxFy based etch processes.
Products for Semiconductor Applications
Below is a selection of the most common products we supply to the semiconductor industry. Visit the Products page to see the full range.
With a specialist elastomer for every sealing application, our engineers can identify an elastomer O-ring to perform perfectly in your operating environment.
KF - ISO - NW Flange Fittings (Centering Rings)
NW, KF and ISO size centering ring flange fittings provide reliable vacuum seals within critical semiconductor environments.
Custom designed wafer handling components ensure improved pad retention into mating hardware, simplified assembly and optimum friction to allow fast robotic handling.